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Titanium Disc Targets 98x10mm, 98x12mm, 98x20mm For False Tooth

Baoji City Changsheng Titanium Co.,Ltd
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Titanium Disc Targets 98x10mm, 98x12mm, 98x20mm For False Tooth

Brand Name : CSTY

Model Number : Gr.1

Certification : GB/T19001-2016/ISO9001:2015

Place of Origin : CHINA

MOQ : 100pcs

Price : $10.00 - $58.00/ Piece

Payment Terms : L/C, T/T, Western Union, MoneyGram,Paypal

Supply Ability : 10000 pieces per Month

Delivery Time : 3-5days

Packaging Details : wooden case,carton Packaging can be according to customer requirements.

Size : Customized

Target Type : Rotatable

Density : Customized

Thickness : 1-10mm

Surface Finish : Polished

Standard : ASTM F67

Forming Process : Hot Isostatic Pressing(HIP)

Grade : Grade 1, Grade 2

Surface : Polished, Pickling, Anodizing

Sputtering Method : DC or RF

Keywords : 99.9995 High purity titanium targets

Substrate Compatibility : Customized

Target Bonding : Indium

Backing Plate : Available

Shape : Round

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Description

Titanium sputtering targets are high-purity materials used in thin-film deposition for wear-resistant, decorative, semiconductor, and optical coatings.
Titanium (Ti) is a lustrous, silvery-white metal known for its high strength-to-weight ratio, excellent corrosion resistance, and biocompatibility.

With a melting point of 1660°C, density of 4.5 g/cm³, and vapor pressure of 10⁻⁴ Torr at 1453°C, titanium is ideal for high-temperature and vacuum applications.
Its strong yet lightweight nature makes it a preferred choice in aerospace, marine, biomedical, and luxury goods manufacturing.

Titanium sputtering targets are evaporated under vacuum and used to deposit thin films of Ti, TiN, or TiO₂ for functional and decorative coatings.

Specifications

Item Titanium Sputtering Target
Material High Purity Titanium (99.5%, 99.995%)
Grades Gr1, Gr2, Gr5 (Ti-6Al-4V), Gr7
Standards ASTM B381, ASTM B265, ASTM F67, ASTM F136
Shapes Available Disc / Rectangular Plate / Custom Size
Applications Decorative coatings, optical coatings, semiconductors, integrated circuits, and wear-resistant films

Physical Properties

Grade Tensile Strength (MPa min) Yield Strength (MPa min) Elongation (% min)
Gr1 240 170 24
Gr2 345 275 20
Gr3 450 380 18
Gr4 550 483 15
Gr5 895 828 10
Gr7 400 275 18
Gr9 620 483 15
Gr12 483 348 18
Gr23 (Gr5 ELI) 793 759 10

Chemical Composition

Grade Fe (max) O (max) N (max) C (max) H (max) Pd (%) Al (%) V (%) Ni (%) Mo (%)
Gr1 0.20 0.18 0.03 0.08 0.015
Gr2 0.30 0.25 0.03 0.08 0.015
Gr3 0.30 0.35 0.05 0.08 0.015
Gr4 0.50 0.40 0.05 0.08 0.015
Gr5 0.40 0.20 0.05 0.08 0.015 5.5–6.7 3.5–4.5
Gr7 0.30 0.25 0.03 0.08 0.015 0.12–0.25
Gr9 0.25 0.15 0.03 0.08 0.015 2.5–3.5 2.0–3.0
Gr12 0.30 0.25 0.03 0.08 0.015 0.6–0.9 0.2–0.4
Gr23 (Gr5 ELI) 0.25 0.03 0.03 0.08 0.0125 5.5–6.5 3.5–4.5

Base Element: Ti (Balance)

Applications

1. Titanium Targets

Used for hardware tool coating, decorative coating, semiconductor components, and flat-panel display coatings.
It is a core material for integrated circuit fabrication, typically requiring purity ≥99.99%.

2. Aluminum Targets

Used in semiconductor and reflective coating applications.
Aluminum offers excellent heat resistance, electrical conductivity, and low weight, making it ideal for containers, automotive, and aerospace coatings.

3. Copper Targets

Employed where high electrical conductivity is essential, such as ein lectrodes, thin-film circuits, and conductive coatings.

4. Tin Targets

Used to enhance corrosion resistance and surface durability in coated materials.

5. Zinc Targets

Provide a protective corrosion-resistant barrier on base metals. Common in batteries, paints, and cathodic protection coatings.

6. Precious Metal Targets (Platinum, Silver, Gold)

Applied for electronic instruments, sensors, and electrode coatings due to their chemical stability, conductivity, and reflectivity.

Advantages

High melting point and chemical stability

Excellent adhesion in PVD/CVD processes

Corrosion resistance in both oxidizing and reducing environments

Available in multiple shapes and purity levels

High film uniformity and purity for semiconductor applications


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